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Are you having trouble with heat dissipation measures for the substrate?

Are you having trouble with heat dissipation measures for the substrate?

We propose a substrate that addresses your concerns regarding heat dissipation for UV-LEDs and UV protection.

If you need UV LEDs or high-brightness LED substrates, trust Arrow Industries! With over 20 years of experience in designing and manufacturing special substrates and heat dissipation substrates, we provide comprehensive support from printed circuit board design and manufacturing to component mounting and assembly through in-house production. 【Heat Dissipation Solutions with Special Substrates】 ■ Metal (Copper/Aluminum) Bump Substrates A substrate that utilizes the remaining metal bump areas, which are not etched, for heat dissipation after etching a copper plate. ■ Water-Cooled Circuit Substrates A high heat dissipation substrate that integrates a water-cooled heat sink directly bonded to a metal base substrate. 【UV-Countermeasure Substrates for UV-LEDs】 ■ Hybrid Substrates A hybrid substrate developed to prevent connector degradation due to ultraviolet light, combining copper-based substrates with glass epoxy substrates. ■ Inorganic Resist Coated Substrates An inorganic resist coated substrate that maintains high reflectivity even in the UV-C range, ensuring long-term reliability. *For detailed features of the substrates, please download our materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • LED lighting
  • Heat dissipation measures

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[For automobiles] TE-7901K: Weight reduction and heat dissipation measures

[For automobiles] TE-7901K: Weight reduction and heat dissipation measures

A one-component epoxy resin that achieves lightweight automotive parts and thermal management.

In the automotive industry, reducing the weight of components has become a crucial challenge to achieve both improved fuel efficiency and safety. At the same time, with the proliferation of electric vehicles (EVs) and hybrid electric vehicles (HEVs), heat dissipation measures for motors and power devices are also essential. TE-7901K contributes to addressing these challenges with its lightweight design and high thermal conductivity for effective heat dissipation. 【Application Scenarios】 - Sealing of electronic components such as motors, inverters, and ECUs - Heat dissipation measures for onboard electronic devices 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction of components - Enhanced reliability of electronic components due to high thermal conductivity - Improved workability due to its single-component nature

  • Resin container
  • Heat dissipation measures

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